MOTEK and BondExpo
in Formation Flight!
Mid-June 2017, and thus 15 weeks before the 36th Motek and the 11th Bondexpo open their doors, a full house is shaping up at the Stuttgart Exhibition Centre. All of the earmarked exhibition halls (3, 5 and 7 as well as 4, 6 and 8) are already fully occupied to a great extent and the Motek international trade fair for automation in production and assembly and the Bondexpo international trade fair for bonding technology are thus steadfastly remaining on course for success! With currently just under 800 exhibitors for Motek and 75 for Bondexpo, the trade fair promoter's stated goal of attracting 1000 exhibitors to the European centre for production technology is now within reach.
To an ever greater extent, the industry meet for production and assembly automation is also drawing the interest of suppliers and above all users from specialised and in particular cross-divisional business disciplines. Sheet metal and plastics processing, woodworking, test technology, packaging and order-picking technology, as well as intra-logistics and distribution can be mentioned in this respect. Overlapping processes and increasing degrees of digitalisation and automation, as well as the performance capabilities of modern, highly flexible and universally deployable handling and robot systems, are resulting in new spheres of activity for precisely these technologies.
The same applies to the use of the bonding, sealing, insulating, foaming and encapsulation technologies presented at Bondexpo, because in particular these are opening themselves up to further possible applications along with increasing use of hybrid materials, fibrous composite materials and other composites - in many cases the joining and fastening of such materials is only made possible at all by adhesives etc. One of the most demanding challenges in this regard is the application of adhesives, which should not only be economically and functionally efficient, but rather emission-free, clean and residue-free as well. Multi-axis handling systems and above all industrial robots are ideally suited for this purpose, and in general for streamlined process automation involving bonding, as well as thermal and mechanical joining and fastening, which will be impressively demonstrated by the complementary Motek-Bondexpo trade fair duo.
Where information and communication offerings are concerned, Motek would be incomplete without the accompanying special shows and forum events, for example the "Arena of Integration" organised by the Mechatronics Network of Baden-Württemberg and the exhibitor forum held by private trade fair promoters P.E. Schall GmbH & Co. KG. Further accompanying events are in the planning, so that a well-rounded "business meet" with theoretical and empirical information covering hardware and software is emerging once again for the 31st Motek and the 11th Bondexpo. The special trade fair guides covering "Assembly Systems Fabrication and Robot System Integration", as well as "Joining Technology", will be available again this year for on-site route planning, and will provide the expert visitors with targeted support. Furthermore, the new websites operated by trade fair promoters P.E. Schall GmbH & Co. KG which will go online in the near future - including a separate website for Motek - will provide exhibitors and expert visitors with useful information, comments and links.
Images: R. Eberhard, messekompakt.com, EBERHARD print & medien agentur gmbh
Source: P.E. Schall