Hardware and Software for Automation Processes
The Motek - International Trade Fair for Automation in Production and Assembly, has gotten off to a very good start in 2017 with strong bookings amounting to nearly 600 exhibitors! According to details provided by longstanding project manager Rainer Bachert, the prospects are very good for the 36th edition of Motek, during which the concurrently scheduled Bondexpo international trade fair for bonding technology will also be held for the 11th time: "Immediately after Motek 2016 we were already experiencing very strong demand, which resulted in roughly 600 firm bookings by the end of 2016 and the beginning of 2017. Not least of all for this reason, and because we once again have all of the market leaders on-board from the various automation sectors, we're working towards record-breaking participation at Motek, as well as its little sister Bondexpo, and we even expect to be able to exceed the top figures achieved in the record-breaking year of 2015."
As far as unique features are concerned, the Motek international trade fair for automation in production assembly, which welcomed 1049 exhibitors at the last event (including 102 Bondexpo exhibitors), is by far the only technical trade fair that presents worldwide offerings for components, modules, subsystems, complete solutions and ready-to-run systems for all fields of industrial automation. Together with the complementary Bondexpo trade fair, Motek is aligned to "process competence through the linking of robotics and handling technology, material feed and material flow, gripping and processing as well as joining and fastening". The resultant process capability is expressed in terms of hardware and software products, as well as visualisation and haptics, so that visitors are able to experience a highly satisfactory trade fair visit featuring practical solutions and innovative approaches.
The ultramodern Motek international trade fair for automation in production and assembly, which always showcases the most up-to-date offerings, and the Bondexpo international trade fair for bonding technology, embody the "5 Cs" in the field of production and assembly automation, which at any rate include significantly more than just handling and material flow: C 1 stands for competence pool, C 2 promotes mutual cooperation of the process partners, C 3 represents well-functioning robot collaboration, C 4 incorporates the complementary technologies covered by Bondexpo and C 5 goes full circle with all of the parties involved in the automation process in the spirit of congeniality, i.e. fitting precision and interfacing capabilities, and thus represents the logical alliance for practical solutions for current and future I 4.O oriented industries.
The Motek international trade fair for production and assembly automation and the Bondexpo international trade fair for bonding technology will take place at the Stuttgart Exhibition Centre from the 9th through the 12th of October, 2017.
Images: R. Eberhard, messekompakt.com, EBERHARD print & medien GmbH
Quelle: P.E. Schall